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Effect of water on the electrodeposition of copper on nickel in deep eutectic solvents

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journal contribution
posted on 20.03.2020, 13:41 by AYM Al-Murshedi, JM Hartley, AP Abbott, KS Ryder
Most studies of metal electrodeposition in ionic liquids dry the electrolyte thoroughly, as water is thought to be detrimental. In some cases, water has a beneficial effect on deposit morphology. The electrodeposition of copper has been studied in 1ChCl: 2EG-water mixtures. It is shown here that the presence of water increases the apparent brightness of the deposit due to changes in the electrodeposit surface feature size, up to a water content of approximately 20 wt-%. This study characterises speciation and mass transport in solution, and shows that diffusion can be controlled independently of speciation. It is shown that there is an optimal water content, which is thought to originate from formation of a bi-continuous micro-emulsion phase in DES-water mixtures. Additionally, the copper species remains in a predominantly ionic medium at low water content but moves to an aqueous environment when water is the main component.

Funding

This project was funded through the Faraday Institution [grant numbers FIRG005 and FIRG006].

History

Citation

Transactions of the IMF, 2019, 97:6, 321-329

Author affiliation

Department of Chemistry

Version

AM (Accepted Manuscript)

Published in

Transactions of the Institute of Metal Finishing

Volume

97

Issue

6

Pagination

321-329

Publisher

Taylor & Francis, for Institute of Metal Finishing

issn

0020-2967

eissn

1745-9192

Available date

17/09/2019

Publisher version

https://www.tandfonline.com/doi/abs/10.1080/00202967.2019.1671062

Language

English