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High Entropy Alloys as Filler Metals for Joining.

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journal contribution
posted on 05.02.2021, 15:47 by Dan Luo, Yong Xiao, Liam Hardwick, Robert Snell, Matthew Way, Xavier Sanuy Morell, Frances Livera, Nicholas Ludford, Chinnapat Panwisawas, Hongbiao Dong, Russell Goodall
In the search for applications for alloys developed under the philosophy of the High Entropy Alloy (HEA)-type materials, the focus may be placed on applications where current alloys also use multiple components, albeit at lower levels than those found in HEAs. One such area, where alloys with complex compositions are already found, is in filler metals used for joining. In soldering (<450 °C) and brazing (>450 °C), filler metal alloys are taken above their liquidus temperature and used to form a metallic bond between two components, which remain both unmelted and largely unchanged throughout the process. These joining methods are widely used in applications from electronics to aerospace and energy, and filler metals are highly diverse, to allow compatibility with a broad range of base materials (including the capability to join ceramics to metals) and a large range of processing temperatures. Here, we review recent developments in filler metals relevant to High Entropy materials, and argue that such alloys merit further exploration to help overcome a number of current challenges that need to be solved for filler metal-based joining methods.

History

Citation

Entropy 2021, 23(1), 78; https://doi.org/10.3390/e23010078

Author affiliation

Department of Engineering

Version

VoR (Version of Record)

Published in

Entropy (Basel, Switzerland)

Volume

23

Issue

1

Pagination

78

Publisher

MDPI AG

issn

1099-4300

eissn

1099-4300

Acceptance date

05/01/2021

Copyright date

2021

Available date

07/01/2021

Spatial coverage

Switzerland

Language

eng

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